| PART |
Description |
Maker |
| 25C320E/P 25C320E/SN 25C320E/ST 25C320E/ST14 25LC3 |
Fuses, 750mA 125V F CHIP 1206 32K的SPI总线串行EEPROM
Fuses, 2A 125V F CHIP 1206 32K的SPI总线串行EEPROM
SENSOR REFLECTIVE OBJECT 50MA 32K的SPI总线串行EEPROM
LED 525NM ROUND GREEN 3MM 32K的SPI总线串行EEPROM
32K SPI Bus Serial EEPROM 32K的SPI总线串行EEPROM
Fuses, 4A 125V F CHIP 1206 32K的SPI总线串行EEPROM
Fuses, 5A 125V F CHIP 1206
IC Socket Test Clip Connector Type:Plunger Type RoHS Compliant: Yes
SENSOR PHOTOLOGIC REFLECTIVE
Transformers Only Module
Connector Adapter; Convert From:Phone Jack; Convert To:Double Banana Plug; Body Material:Brass; Body Style:Straight RoHS Compliant: Yes
Fuses, 375mA 125V F CHIP 1206
Binding Post; Current Rating:3A; Body Material:Phosphor Bronze; Color:Black; Voltage Rating:2500V
Fuses, 1.25A 125V F CHIP 1206
Fuses, 1A 125V F CHIP 1206
Fuses, 3.5A 125V F CHIP 1206
Filter Module w/out Resistor Network
Fuses, 1.5A 125V F CHIP 1206
Fuses, 2.5A 125V F CHIP 1206
|
Microchip Technology, Inc.
Microchip Technology Inc.
|
| HDG12864F-3 |
128x64 GRAPHICS Chip-On-Glass Parallel interface LCD DISPLAY MODULE 128x64图形芯片玻璃上并行接口液晶显示模
128 x 64 Graphics Chip On Glass LCD Display Module
|
Electronic Theatre Controls, Inc.
Hantronix,Inc
|
| JE93I9HTR5 JE9 JE9112HR1 JE9112HR2 JE9112HR3 JE911 |
Digital Media System-on-Chip (DMSoC) 338-NFBGA 大功率磁保持继电
2.0mV Quad Ultra Micropower Rail-to-Rail CMOS Operational Amplifier, 24L SOIC 大功率磁保持继电
HIGH POWER LATCHING RELAY 大功率磁保持继电
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 4.6mJ, 68msec@25mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 55mJ, 88msec@150mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 8.3mJ, 80msec@25mA
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 30mJ, 75msec@150mA
SOIC socket added to Adapter Module
|
Hongfa Relay
???瀹???靛０?′唤??????
Xiamen Hongfa Electroacoustic Co., Ltd.
厦门宏发电声股份有限公司
HONGFA[Hongfa Technology]
|
| HT1MOA3S30 HT1MOA3S30_E_1 HT1MOA3S30_E_3 |
HITAGTM1 Chip Module
|
NXP Semiconductors
|
| MM196 |
6 MOSFET Multi-Chip Module
|
Microsemi Corporation
|
| DM3030 |
Multilayer Chip Diplexer Module
|
Advanced Ceramic X
|
| MC-7896-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| ROK104022 ROK104001 ROK104021 |
Bluetooth MULTI CHIP MODULE
|
Infineon Technologies A...
Infineon Technologies AG
|
| MC-7891-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| V048K480T006 V048F480M006 V048F480T006 V048K480M00 |
VI Chip - VTM Voltage Transformation Module
|
VICOR[Vicor Corporation]
|
| B352F110M24 |
VI Chip - BCM Bus Converter Module
|
Vicor Corporation
|
